Interconnections (of Electronic Components) White Papers

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Extending the World's Most Popular Processor Architecture
sponsored by Intel Corporation
WHITE PAPER: This paper will provide a brief background on instruction set architecture (ISA) and review new instructions, including SSE4 vectoring compiler and media accelerators, SSE4 efficient accelerated string and text processing, and Application T...
Posted: 26 Jun 2007 | Published: 01 Jan 2006

Intel Corporation

A reference architecture for a leading solution
sponsored by DellEMC and Intel®
WHITE PAPER: This white paper explores the reference architecture for a leading server solution. Learn how this architecture is designed to influence the benefits of virtualizing the underlying infrastructure and address the common problems associated with hardware sprawl.
Posted: 21 Oct 2014 | Published: 30 Sep 2014

DellEMC and Intel®

Dell PowerEdge C8000 Series: Flexible, Powerful, and Efficient
sponsored by Dell, Inc. and Intel®
WHITE PAPER: Check out this brief resource to learn about the Dell PowerEdge C8000 – the only shared infrastructure which enables organizations to easily reconfigure, refresh and scale out as needed.
Posted: 19 Feb 2014 | Published: 19 Feb 2014

Dell, Inc. and Intel®

Improving Data Center Infrastructure with Oracle's x86 Systems
sponsored by Oracle Corporation
WHITE PAPER: Learn how your organization can fight the complexity that usually comes with virtualization and cloud computing. This white paper presents a vendor that can offer a complete hardware and software stack for virtualized x86 infrastructures which allows enhanced reliability, optimized performance and cost savings.
Posted: 27 Jun 2012 | Published: 25 Jun 2012

Oracle Corporation

NetBackup Disk Based Data Protection Options
sponsored by Symantec Corporation
WHITE PAPER: This paper explains the disk options and their capabilities as well as the other new features in NetBackup 6.5 that make up the Enterprise Disk Foundation, also it provides guidance in choosing the appropriate disk options for your environment.
Posted: 03 Jun 2008 | Published: 01 Oct 2007

Symantec Corporation

Enterprise Solution Design for SAP HANA
sponsored by HP & Intel®
WHITE PAPER: In this resource, explore the three principles of great enterprise design—stability, scalability, and agility—and learn how to apply them to your SAP landscape with a focus on SAP HANA. Read on for best practices and key design considerations for implementing your SAP HANA enterprise-level solution.
Posted: 25 Sep 2013 | Published: 28 Feb 2013

HP & Intel®

Efficient Data Center: Using data center instrumentation and server refresh to optimize compute performance in constrained environments
sponsored by Dell, Inc. and Intel®
WHITE PAPER: This white paper examines the current state of data center power and cooling. Explore the advantages of a hardware refresh and determine if an upgrade is right for your organization.
Posted: 29 Aug 2012 | Published: 01 Jul 2011

Dell, Inc. and Intel®

Can Your Data Center Infrastructure Handle the Heat of High Density
sponsored by CyrusOne
WHITE PAPER: High density computing is today's standard in best-in-class performance and availability, and those that fail to keep pace or fall behind will find themselves no longer competitive in today's markets.
Posted: 11 Aug 2008 | Published: 01 Aug 2008

CyrusOne

Wyse Intel-Based 3000 Series Thin Client: Powerful, Highly Configurable
sponsored by Dell
WHITE PAPER: Get a quick look at the Wyse Intel-based 3000 series thin client, a solution capable of driving a range of applications.
Posted: 13 Nov 2014 | Published: 11 Nov 2014

Dell

Cutting Edge Multicore Development Techniques for the Next Wave of Electronics Products
sponsored by IBM
WHITE PAPER: As more and more software is embedded into both consumer and industrial electronics, the electronics industry is being challenged with ensuring rigor within its software development process, often a new core competency, and the integration of hardware and software. Read this paper to learn about solutions that address these complex challenges.
Posted: 01 Sep 2010 | Published: 19 Mar 2010

IBM